Dynamic analysis of a thermal–induced stress in an elastic circular plate

Abstract

Stress is a phenomenon that could cause a lot of destruction to engineering structures if there are no adequate in-built absorbers in such structures. Buildings, bridges and such other structures must therefore be protected from excessive stress in other to maintain their shapes and forms and hence to guarantee the life span of these structures because of the negative effects this phenomenon may have on them if left unchecked. In this work we study the magnitude of a thermal-induced stress in a circular elastic plate of radius b with an indented circular hole of radius a at the center. The magnitudes of the normal and tangential components for various span ratio ab are computed. The results of this analysis show a definitive relationship between the stress profile and variability in span ratio.



Journal of the Nigerian Association of Mathematical Physics Vol. 8 2004: pp. 57-60