Enhancement of deposition rate by accelerators employing D-Mannitol as complexing agent

Abstract

Copper possesses better conductivity which makes it an ideal plating choice for the electronics and semiconductor industries. Copper electroless plating can be carried easily on non-conductors like plastics, ceramics, fabrics, glasses etc. One of the limitations of electroless plating is its very low plating rate, which is further reduced by the addition of stabilizers which is quite essential for the plating process. A stabilizer improves stability of bath and deposit qualities, but slows down the plating rate. The current study focuses on the enhancement of plating rate by the addition of accelerators in eco-friendly      copper methane sulphonate bath. It is observed that accelerators like guanidine hydrochloride and 2,6-diaminopyridine improves the rate of deposition with good deposit quality. It was studied with weight gain method and analyzed with tafel polarization studies. The surface of the deposit was analyzed with X-ray diffraction (XRD) and scanning electrode microscope (SEM).

KEY WORDS: Copper, Methane sulphonic acid, Accelerators, Guanidine hydrochloride, 2,6- Diaminopyridine

Bull. Chem. Soc. Ethiop. 2024, 38(4), 901-908.                                                        

DOI: https://dx.doi.org/10.4314/bcse.v38i4.7